Compact Multilayer Bandpass Filter Using Low-Temperature Additively Manufacturing Solution

This article presented an additively manufactured bandpass filter (BPF) based on a second-order stub-loaded resonator consisting of multimetal layer components. The proposed BPF is fabricated by low-temperature (140°) electronics (AME) solution that can fabricate conductive and dielectric materials simultaneously with multimetal-layer flexible interlayer distance. By reducing the distance, constant inductance capacitance be realized in smaller sizes, which helps to achieve device minimization. Taking advantage this inkjet printing technology, proposed. To understand principle BPF, equivalent circuit odd- even-mode analysis demonstrated. For verification, frequency response circuit's mathematical model calculated compare electromagnetic simulation results. Good agreement achieved among calculated, simulated, measured designed at 12.25 GHz bandwidth 40.8% compact size 2.7 mm ×1.425 ×0.585 or 0.186λg ×0.098λg×0.040λg, suitable for circuit-in-package applications television programs, radar detection, satellite communications.